Opto-Electronic Packaging Consulting
With more than 25 years of international experience in semiconductor and opto-electronic technologies, I provide consulting services covering the complete development cycle of advanced opto-electronic and semiconductor packaging solutions — from concept and feasibility studies to industrialization and high-volume manufacturing.
My expertise combines deep technical knowledge with practical experience in research, development, supplier management, quality systems, and manufacturing optimization across Europe, the United States, and Asia.
Core Competencies
- Opto-electronic packaging design and development
- High-frequency and high-speed module packaging (>110 GHz)
- Photonic IC (PIC) packaging and RF characterization solutions
- Semiconductor package design for high-performance and high-power applications
- Thermal, electrical, and reliability-focused package optimization
- Advanced interconnect technologies including wire bonding, flip-chip, COB, and embedded packaging
- Prototype manufacturing and cleanroom-based assembly processes
- Design-for-manufacturing (DfM) and cost optimization
- Subcontractor (OSAT) selection, qualification, and management
- Production ramp-up support and yield improvement
- Risk analysis and mitigation using FMEA methodologies
- Quality Management Systems (QMS) and document control implementation
- Technology roadmaps, benchmarking, and innovation management
Industry Experience
Throughout my career, I have worked with leading international technology companies and research organizations including u-blox, Texas Instruments, ABB, Huawei Technologies, NXP Semiconductors, and innovative photonics startups such as Polariton Technologies.
Recent consulting activities include support for RF packaging solutions for Photonic IC characterization, development of ultra-high-bandwidth opto-electronic modulators, and advanced packaging concepts for next-generation semiconductor applications.
Consulting Services
I support companies, startups, and research organizations in:
- Evaluation and development of packaging concepts
- Feasibility studies and technology assessments
- Supplier and manufacturing strategy
- Packaging architecture and material selection
- Reliability and risk analysis
- Process development and industrialization
- Production transfer and subcontractor qualification
- Failure analysis and problem solving
- R&D organization and development process setup
- Technology and patent landscape assessments
International & Cross-Functional Expertise
My projects typically involve close collaboration between multidisciplinary teams across R&D, manufacturing, quality, procurement, and external suppliers. I bring extensive experience in managing complex international projects involving partners and manufacturing sites in Europe, Taiwan, Japan, Korea, China, and the United States.
In addition to technical expertise, I offer structured project execution, strong analytical capabilities, and a pragmatic, solution-oriented approach focused on performance, manufacturability, reliability, and cost efficiency.