Semiconductor Packaging Consulting
With more than 25 years of international experience in semiconductor packaging, power electronics, RF and opto-electronic modules, I support companies in the development, industrialization, and optimization of advanced packaging solutions — from concept and feasibility studies to high-volume manufacturing.
My background includes technical and management roles at leading technology companies including u-blox, Texas Instruments, ABB Semiconductors, Huawei Technologies, and Philips Semiconductors.
Consulting Services
Advanced Semiconductor Packaging
- Package design and development for ICs, power semiconductors, RF devices, and opto-electronic modules
- High-voltage and high-power packaging solutions
- Embedded packaging technologies
- Packaging concepts for photonic and RF applications up to 110 GHz
- Chip-on-board (COB), multichip modules (MCM), wire bonding, and flip-chip technologies
Design for Manufacturing & Industrialization
- Transfer from prototype to mass production
- Manufacturing process optimization and yield improvement
- Production ramp-up support
- Throughput analysis, capacity planning, and equipment investment evaluation
- Cost optimization and manufacturability analysis
Simulation & Reliability Engineering
- Thermal and electrical simulations of semiconductor packages
- Reliability engineering and risk mitigation
- Design and Process FMEA
- Statistical data analysis and problem solving using Six Sigma methodologies
OSAT & Supply Chain Support
- Selection, qualification, and management of subcontractors and OSAT partners
- Supplier evaluation in Europe, Taiwan, Japan, Korea, China, and the USA
- Technical interface management between design teams and manufacturing partners
Technology & Innovation Management
- Technology roadmaps and competitive benchmarking
- Packaging strategy development
- Patent and intellectual property support
- Technology scouting and innovation assessment
Project & Team Leadership
- Leadership of international, multi-site development projects
- Setup and management of R&D and production engineering teams
- Cross-functional coordination between engineering, manufacturing, quality, and suppliers
Industry Experience
- Semiconductor devices and IC packaging
- Power electronics and IGBT modules
- RF and photonic integrated circuit (PIC) packaging
- Opto-electronics and telecom applications
- Wide-bandgap semiconductor packaging
- Medical devices and regulated product development
International Experience
Extensive collaboration with development and manufacturing teams across Europe, the United States, Taiwan, Japan, Korea, and China.